****代po*** 朋友在intel Chandler AZ 組內有缺人。可幫忙看履歷直接內推給招人經理。 至少要有美國合法簽證（f1-pot, EAD）公司會幫忙辦h1及綠卡。 *請不要站內信* 有意願者請聯繫email: [email protected] 任何問題也請email聯繫 *請不要站內信* Job description: Microelectronic Packaging R&D Engineers provide project management, package de sign/development and sustaining support for integrated circuit or semiconducto r processes. Responsibilities will include, but not be limited to: ‧Assembly processes and/or equipment development, and applying novel concepts in ball attach technology solutions for next-generation CPUs and devices. ‧You will also be helping develop innovative solutions to enable Intel's road map of future assembly packaging platform technologies. In this position, you will be developing processes to meet quality, reliability, cost, yield, produc tivity and manufacturability requirements. ‧Innovating, problem solving, developing, and continuously improving equipmen t and processes using experimental design and statistical methods. ‧Process and equipment specification development, applying principles for des ign of experiments and data analysis, and planning and documentation of improv ements through the white paper process. ‧Developing solutions to problems utilizing formal education, statistical kno wledge, and problem-solving tools. ‧Training production and process engineers for technology transfer to other f actories worldwide for High Volume Manufacturing. The ideal candidate should exhibit the following behavioral traits: ‧Proven technical leadership skills: leadership, strategic planning, coaching and development of a technical team. ‧Demonstrated ability to successfully lead teams in a highly matrix environme nt managing budgets, resources and timelines, as well as proven stakeholder ma nagement. ‧Flexibility in changing priorities and responsibilities to support business needs. Tolerance for ambiguity in a fast paced, constantly changing product ro admap environment. ‧Strong influencing, written and verbal communication skills. ‧Self-initiated, Action-Oriented with the ability to work independently. Qualifications You must possess the below minimum qualifications to be initially considered f or this position. Experience listed below would be obtained through a combinat ion of your school work/classes/research and/or relevant previous job and/or i nternship experiences. Minimum Qualifications: ‧Possess a MS/PhD degree in Mechanical Engineering/Material Engineering/Elect rical Engineering/Physics related field. Preferred qualifications: ‧Strong knowledge of Statistical Process Control (SPC) and/or Design of Exper iments (DOE) principles. ‧Hands-on participation and a strong sense of ownership; frequent floor prese nce and interaction with manufacturing personnel. ‧Demonstrate technical innovation and delivered results for complex, time cri tical technical projects; Fundamental understanding of semiconductor fabricati on processes and technology with strong technical and analytical skills and pr oblem-solving techniques. ‧Ability to apply fundamental science and engineering concepts in development to create novel solutions. --

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