清华大学动力机械工程学系 短期课程 (本课程完全免费并提供上课讲义) 课程名称：Introduction to MEMS and NEMS 授课老师：林立伟 教授 Prof. Liwei Lin 清华大学动机系 讲座教授（客座） Chancellor’s Professor Department of Mechanical Engineering Co-Director, Berkeley Sensor and Actuator Center University of California at Berkeley, USA 地点：清华大学工程一馆 108室 时间：2009年9月8日 - 9月9日 课程资讯：http://www.pme.nthu.edu.tw/extra/class_info.php 报名：http://www.pme.nthu.edu.tw/extra/class_register.php 课程内容： September 8, 2009 (Tuesday) 09:00 - 10:30 am Introduction to MEMS 10:30 - 11:00 am Break 11:00 - 12:30 pm Surface-Micromachining 12:30 - 01:30 pm Lunch 01:30 - 03:00 pm Bulk-Micromachining and Other Processes 03:00 - 03:30 pm Break 03:30 - 05:00 pm MEMS Packaging and Approaches September 9, 2009 (Wednesday) 09:00 - 10:30 am Introduction to NEMS 10:30 - 11:00 am Break 11:00 - 12:30 pm 1-D Nanostructures – Carbon Nanotubes and Nanowires 12:30 - 01:30 pm Lunch 01:30 - 03:00 pm 0-D Nanostructures – Quantum Dots 03:00 - 03:30 pm Break 03:30 - 05:00 pm Open Discussions Who Should Attend? This short course targets students/researchers with no or minimum knowledge in the areas of MEMS (Microelectromechanical Systems) and NEMS (Nanoelectromechanical Systems). Attendees with basic understandings in physics, chemistry and engineering mechanics, although not necessary, will be helpful in understanding the course materials. Course Description: The course aims to provide basic knowledge of microelectromechanical systems and nanoelectromechanical systems including design, fabrication of micro and nanostructures’ various micro- and nano-machining processes; fabrication principles of integrated circuit device and their applications for making MEMS/NEMS devices; and device/system examples. During the first day of the short course, an overview of MEMS manufacturing technologies and related device manufacturing issues will be introduced at the beginning. Specific MEMS fabrication processes such as surface- and bulk-micromachining processes for key MEMS commercial products will then be addressed. Packaging related topics such as hermetical sealing processes, accelerated testing and vacuum encapsulation skills will be discussed, along with advanced approaches for MEMS packaging and assembly, integration issues and future directions. During the second day of the short course, nanofabrication technology will be discussed, including how one achieves the nanometer length scale, including "bottom up" and "top down" technologies; examples of nanoscience phenomena (the crossover from bulk to quantum mechanical properties); and applications (from integrated circuits, quantum computing, MEMS, and bioengineering). An open discussion at the end will conclude the two-day short course. 欢迎自行转载 ------------------------------------------------------------------------------ 充电会版位址如下： PTT→分组讨论区→生活娱乐馆→Life_Plan 人生→Refresh【充电板】─终身学习 ------------------------------------------------------------------------------ --

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